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Microvascular materials containing internal microchannels are able to achieve multi-functionality by flowing different fluids through vasculature. Active cooling is one application to protect structural components and devices from thermal overload, which is critical to modern technology including electric vehicle battery packaging and solar panels on space probes. Creating thermally efficient vascular network designs requires state-of-the-art computational tools. Prior optimization schemes have only considered steady-state cooling, rendering a knowledge gap for time-varying heat transfer behavior. In this study, a transient topology optimization framework is presented to maximize the active-cooling performance and mitigate computational cost. Here, we optimize the channel layout so that coolant flowing within the vascular network can remove heat quickly and also provide a lower steady-state temperature. An objective function for this new transient formulation is proposed that minimizes the area beneath the average temperature versus time curve to simultaneously reduce the temperature and cooling time. The thermal response of the system is obtained through a transient Geometric Reduced Order Finite Element Model (GRO-FEM). The model is verified via a conjugate heat transfer simulation in commercial software and validated by an active-cooling experiment conducted on a 3D-printed microvascular metal. A transient sensitivity analysis is derived to provide the optimizer with analytical gradients of the objective function for further computational efficiency. Example problems are solved demonstrating the method’s ability to enhance cooling performance along with a comparison of transient versus steady-state optimization results. In this comparison, both the steady-state and transient frameworks delivered different designs with similar performance characteristics for the problems considered in this study. This latest computational framework provides a new thermal regulation toolbox for microvascular material designers.

 

Due to their lower pressure drop, impinging cold-plates are preferred over parallel flow cold-plates when there is no strict space limitation (i.e. when flow can enter perpendicular to the electronic board). Splitting the flow into two branches cuts the flow rate and path in half, which leads to lower pressure drop through the channels. A groove is used to direct the flow exiting the diffuser into the channels. The number of the geometric design parameters of the cold-plate will vary depending on the shape of the groove. In this research, the response surface method (RSM) was used to optimization the fin geometry of an impinging cold-plate with a trapezoidal cross section groove. The cold plate is used for warm water cooling of electronics. Three fin parameters (thickness, height, and gap) and three groove parameters were optimized to reach minimum values for hydraulic and thermal resistances at fixed values of coolant inlet temperature, coolant flow rate, and electronic chip power.